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INTEGRATED CIRCUITS
DATA SHEET
TDA8002 IC card interface
Product specification Supersedes data of 1997 Mar 13 File under Integrated Circuits, IC02 1997 Nov 04
Philips Semiconductors
Product specification
IC card interface
FEATURES * Single supply voltage interface (3.3 or 5 V environment) * Low-power sleep mode * Three specific protected half-duplex bidirectional buffered I/O lines * VCC regulation (5 V 5%, ICC <65 mA at VDD = 5 V, with controlled rise and fall times * Thermal and short-circuit protections with current limitations * Automatic ISO 7816 activation and deactivation sequences * Enhanced ESD protections on card side (>6 kV) * Clock generation for the card up to 12 MHz with synchronous frequency changes * Clock generation up to 20 MHz (auxiliary clock) * Synchronous and asynchronous cards (memory and smart cards) * ISO 7816, GSM11.11 compatibility and EMV (Europay, Mastercard, Visa) compliant * Step-up converter for VCC generation QUICK REFERENCE DATA SYMBOL Supply VDDA IDD analog supply voltage supply current sleep mode idle mode; fCLK = 2.5 MHz; fCLKOUT = 10 MHz; VDD = 5 V active mode; fCLK = 2.5 MHz; fCLKOUT = 10 MHz; VDD = 5 V active mode; fCLK = 2.5 MHz; fCLKOUT = 10 MHz; VDD = 3 V Card supply VCC(O) ICC(O) General fCLK Tde Ptot card clock frequency deactivation cycle time continuous total power dissipation TDA8002AT; TDA8002BT TDA8002G Tamb operating ambient temperature Tamb = -25 to +85 C Tamb = -25 to +85 C - - -25 - - - 0 60 - 80 output voltage output current DC load <65 mA VCC short-circuited to GND 4.75 - - - 3.0 - - - - 5 - - - - PARAMETER CONDITIONS MIN. TYP.
TDA8002
* Supply supervisor for spikes elimination and emergency deactivation. APPLICATIONS * IC card readers for: - GSM applications - banking - electronic payment - identification - Pay TV - road tolling. GENERAL DESCRIPTION The TDA8002 is a complete low-power, analog interface for asynchronous and synchronous cards. It can be placed between the card and the microcontroller. It performs all supply, protection and control functions. It is directly compatible with ISO 7816, GSM11.11 and EMV specifications.
MAX.
UNIT
6.5 150 6 9 12
V A mA mA mA
5.25 100
V mA
12 100 0.56 0.46 +85
MHz s W W C
1997 Nov 04
2
Philips Semiconductors
Product specification
IC card interface
ORDERING INFORMATION TYPE NUMBER(1) MARKING TDA8002AT/3/C2(2) TDA8002AT/5/C2(3) TDA8002BT/3/C2(2) TDA8002G/3/C2(2) TDA8002G/5/C2(3) Notes 1. The /3 or /5 suffix indicates the voltage supervisor option. TDA8002AT/3 TDA8002AT/5 TDA8002BT/3 80023 80025 LQFP32 plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm NAME SO28 PACKAGE DESCRIPTION plastic small outline package; 28 leads; body width 7.5 mm
TDA8002
VERSION SOT136-1
TDA8002BT/5/C2(3) TDA8002BT/5 SOT401-1
2. The /3 version can be used with a 3 or 5 V power supply environment (see Chapter "Functional description"). 3. The /5 version can be used with a 5 V power supply environment.
1997 Nov 04
3
Philips Semiconductors
Product specification
IC card interface
BLOCK DIAGRAM
TDA8002
handbook, full pagewidth
VDDD 100 nF
VDDA 100 nF 100 nF S1 S2 12
28 SUPPLY ALARM ALARM 4 3 INTERNAL REFERENCE VREF
13
14
STEP-UP CONVERTER INTERNAL OSCILLATOR fINT 15 VUP 100 nF
VOLTAGE SENSE ALARM EN1 CLKUP
OFF RSTIN CMDVCC MODE
26 25 24 27 SEQUENCER
EN2 PVCC VCC GENERATOR 23 100 nF 22 19 18 CLOCK CIRCUITRY HORSEQ EN4 CLOCK BUFFER 21 CLK RST PRES PRES VCC
EN5
RST BUFFER
CLKDIV1 CLKDIV2 CLKSEL STROBE CLKOUT
6 7 5 8 9 CLK EN3 OSCILLATOR THERMAL PROTECTION
XTAL1 XTAL2
30 31
AUX1UC
1
I/O TRANSCEIVER
20
AUX1
TDA8002G
AUX2UC 2 I/O TRANSCEIVER 17 AUX2
I/OUC
32
I/O TRANSCEIVER
16
I/O
10
29
11
MGE730
DGND1 DGND2
AGND
All capacitors are mandatory.
Fig.1 Block diagram (TDA8002G).
1997 Nov 04
4
Philips Semiconductors
Product specification
IC card interface
PINNING PIN SYMBOL TYPE A XTAL1 XTAL2 I/OUC AUX1UC AUX2UC ALARM ALARM CLKSEL CLKDIV1 CLKDIV2 STROBE CLKOUT DGND1 AGND S2 VDDA S1 VUP I/O AUX2 PRES PRES AUX1 CLK RST VCC CMDVCC RSTIN OFF MODE VDDD DGND2 1 2 3 4 5 - 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 - 21 22 23 24 25 26 27 28 - - TYPE B 1 2 3 4 - 5 6 7 8 9 10 11 12 13 14 15 16 17 18 - 19 20 21 22 23 24 25 26 27 28 - - TYPE G 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 I/O I/O I/O I/O I/O O O I I I I O supply supply I/O supply I/O I/O I/O I/O I I I/O O O O I I O I supply supply crystal connection or input for external clock crystal connection data I/O line to and from microcontroller I/O DESCRIPTION
TDA8002
auxiliary line to and from microcontroller for synchronous applications auxiliary line to and from microcontroller for synchronous applications open drain NMOS reset output for microcontroller (active LOW) open drain PMOS reset output for microcontroller (active HIGH) control input signal for CLK (LOW = XTAL oscillator; HIGH = STROBE input) control input with CLKDIV2 for choosing CLK frequency control input with CLKDIV1 for choosing CLK frequency external clock input for synchronous applications clock output (see Table 1) digital ground 1 analog ground capacitance connection for voltage doubler analog supply voltage capacitance connection for voltage doubler output of voltage doubler (connect to 100 nF) data I/O line to and from card auxiliary I/O line to and from card active LOW card input presence contact active HIGH card input presence contact auxiliary I/O line to and from card clock to card output (C3) (see Table 1) card reset output (C2) supply for card (C1) (decouple with 100 nF) active LOW start activation sequence input from microcontroller card reset input from microcontroller open drain NMOS interrupt output to microcontroller (active LOW) operating mode selection input (HIGH = normal; LOW = sleep) digital supply voltage digital ground 2
1997 Nov 04
5
Philips Semiconductors
Product specification
IC card interface
TDA8002
handbook, halfpage
handbook, halfpage
XTAL1 XTAL2 I/OUC AUX1UC AUX2UC ALARM CLKSEL CLKDIV1 CLKDIV2
1 2 3 4 5 6 7
28 MODE 27 OFF 26 RSTIN 25 CMDVCC 24 VCC 23 RST 22 CLK
XTAL1 XTAL2 I/OUC AUX1UC ALARM ALARM CLKSEL CLKDIV1 CLKDIV2
1 2 3 4 5 6 7
28 MODE 27 OFF 26 RSTIN 25 CMDVCC 24 VCC 23 RST 22 CLK
TDA8002A
8 9 21 AUX1 20 PRES 19 AUX2 18 I/O 17 VUP 16 S1 15 VDDA
MGE731
TDA8002B
8 9 21 AUX1 20 PRES 19 PRES 18 I/O 17 VUP 16 S1 15 VDDA
MGE732
STROBE 10 CLKOUT 11 DGND1 12 AGND 13 S2 14
STROBE 10 CLKOUT 11 DGND1 12 AGND 13 S2 14
Fig.2 Pin configuration (TDA8002A).
Fig.3 Pin configuration (TDA8002B).
29 DGND2
31 XTAL2
30 XTAL1
27 MODE
AUX1UC AUX2UC ALARM ALARM CLKSEL CLKDIV1 CLKDIV2 STROBE
26 OFF
handbook, full pagewidth
25 RSTIN
28 VDDD
32 I/OUC
1 2 3 4
24 CMDVCC 23 VCC 22 RST 21 CLK
TDA8002G
5 6 7 8 20 AUX1 19 PRES 18 PRES 17 AUX2
DGND1 10
AGND 11
S2 12
VDDA 13
S1 14
VUP 15
I/O 16
9
MGE733
Fig.4 Pin configuration (TDA8002G).
1997 Nov 04
CLKOUT
6
Philips Semiconductors
Product specification
IC card interface
FUNCTIONAL DESCRIPTION Power supply The supply pins for the chip are VDDA, VDDD, AGND, DGND1 and DGND2. VDDA and VDDD (i.e. VDD) should be in the range of 3.0 to 6.5 V. All card contacts remain inactive during power-up or power-down. On power-up, the logic is reset by an internal signal. The sequencer is not activated until VDD reaches Vth2 + Vhys2 (see Fig.5). When VDD falls below Vth2, an automatic deactivation sequence of the contacts is performed. Supply voltage supervisor (VDD) This block surveys the VDD supply. A defined reset pulse of 10 ms minimum (tW) can be retriggered and is delivered on the ALARM outputs during power-up or power-down of VDD (see Fig.5). This signal is also used for eliminating the spikes on card contacts during power-up or power-down. When VDD reaches Vth2 + Vhys2, an internal delay is started. The ALARM outputs are active until this delay has expired. When VDD falls below Vth2, ALARM is activated and a deactivation sequence of the contacts is performed. For 3 V supply, the supervisor option must be chosen at 3 V. For 5 V supply, both options (3 or 5 V) may be chosen depending on the application. Clock circuitry
TDA8002
The TDA8002 supports both synchronous and asynchronous cards (I2C-bus memories requiring an acknowledge signal from the master are not supported). There are three methods to clock the circuitry: * Apply a clock signal to pin STROBE * Use of an internal RC oscillator * Use of a quartz oscillator which should be connected between pins XTAL1 and XTAL2. When CLKSEL is HIGH, the clock should be applied on the STROBE pin, and when CLKSEL is LOW, one of the internal oscillators is used. When an internal clock is used, the clock output is available on pin CLKOUT. The RC oscillator is selected by making CLKDIV1 HIGH and CLKDIV2 LOW. The clock output to the card is available on pin CLK. The frequency of the card clock can be the input frequency divided by 2 or 4, STOP LOW or 1.25 MHz, depending on the states of CLKDIV1 or CLKDIV2 (see Table 1). Do not change CLKSEL during activation. When in low-power (sleep) mode, the internal oscillator frequency which is available on pin CLKOUT is lowered to approximately 16 kHz for power-economy purposes.
handbook, full pagewidth
VDD
Vth2 + Vhys2 Vth2 tW tW
ALARM
ALARM
MGE734
Fig.5 Alarm as a function of VDD (pulse width 10 ms).
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
Table 1 Clock circuitry definition CLKSEL LOW LOW LOW LOW HIGH X(1) CLKDIV1 HIGH LOW LOW HIGH X(1) X(1) CLKDIV2 LOW LOW HIGH HIGH X(1) X(1) FREQUENCY OF CLK
1 f 2 int 1 f 4 xtal 1 f 2 xtal
TDA8002
MODE HIGH HIGH HIGH HIGH HIGH LOW(2) Notes 1. X = don't care. 2. In low-power mode.
FREQUENCY OF CLKOUT
1 f 2 int
fxtal fxtal fxtal fxtal
1 (3) 2fint
STOP LOW STROBE STOP LOW
3. fint = 32 kHz in low-power mode. I/O circuitry The three I/O transceivers are identical. The state is HIGH for all I/O pins (i.e. I/O, I/OUC, AUX1, AUX1UC, AUX2 and AUX2UC). Pin I/O is referenced to VCC and pin I/OUC to VDD, thus ensuring proper operation in case VCC VDD. The first side on which a falling edge is detected becomes a master (input). An anti-latch circuitry first disables the detection of the falling edge on the other side, which becomes slave (output). After a delay time td (about 50 ns), the logic 0 present on the master side is transferred on the slave side. When the input is back to HIGH level, a current booster is turned on during the delay td on the output side and then both sides are back to their idle state, ready to detect the next logic 0 on any side. In case of a conflict, both lines may remain LOW until the software enables the lines to be HIGH. The anti-latch circuitry ensures that the lines do not remain LOW if both sides return HIGH, regardless of the prior conditions. The maximum frequency on the lines is approximately 1 MHz.
handbook, full pagewidth I/O
I/OUC
td
td
td
conflict
idle
MGD703
Fig.6 Master and slave signals.
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
Logic circuitry After power-up, the circuit has six possible states of operation. Table 1 shows the sequence of these states. IDLE MODE After reset, the circuit enters the idle mode. A minimum number of functions in the circuit are active while waiting for the microcontroller to start a session: * All card contacts are inactive * I/OUC, AUX1UC and AUX2UC are high-impedance * Oscillator XTAL runs, delivering CLKOUT * Voltage supervisor is active. ACTIVE MODE LOW-POWER (SLEEP) MODE When pin MODE goes LOW, the circuit enters the low-power (sleep) mode. As long as pin MODE is LOW, no activation is possible. State diagram
TDA8002
If pin MODE goes LOW in the active mode, a normal deactivation sequence is performed before entering low-power mode. When pin MODE goes HIGH, the circuit enters normal operation after a delay of at least 6 ms (96 cycles of CLKOUT). During this time the CLKOUT remains at 16 kHz. * All card contacts are inactive * Oscillator XTAL does not run * The VDD supervisor, ALARM output, card presence detection and OFF output remain functional * Internal oscillator is slowed to 32 kHz, CLKOUT providing 16 kHz.
When the activation sequence is completed, the TDA8002 will be in the active mode. Data is exchanged between the card and the microcontroller via the I/O lines.
handbook, full pagewidth
ACTIVATION
POWER OFF IDLE MODE LOW-POWER MODE FAULT ACTIVE MODE
DEACTIVATION
MGE735
Fig.7 State diagram.
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
ACTIVATION SEQUENCE From idle mode, the circuit enters the activation mode when the microcontroller sets the CMDVCC line LOW or sets the MODE line HIGH when the CMDVCC line is already LOW. The internal circuitry is then activated, the internal clock is activated and an activation sequence is executed. When RST is enabled, it becomes the inverse of RSTIN.
TDA8002
Figures 8 to 10 illustrate the activation sequence as described below: 1. Step-up converter is started (t1 t0) 2. VCC rises from 0 to 5 V (t2 = t1 + 112T) 3. I/O, AUX1, AUX2 are enabled and CLK is enabled (t3 = t1 + 4T); a special circuitry ensures that I/O remains below VCC during falling slope of VCC 4. CLK is set by setting RSTIN to HIGH (t4) 5. RST is enabled (t5 = t1 + 7T); after t5, RSTIN has no further action on CLK, but is only controlling RST.
handbook, full pagewidth
OSC_INT/64 tact CMDVCC VUP VCC I/O CLK RSTIN RST
MGE736
T = 25 s
t0 t1 t2 t3 high - Z t4 t5
Fig.8 Activation sequence using RSTIN and CMDVCC.
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
TDA8002
handbook, full pagewidth OSC_INT/64
CLKDIV1 CLKDIV2 CMDVCC VUP VCC I/O CLK RSTIN RST t0 t1 t2 t3 high - Z
tact
MGE737
Fig.9 Activation sequence using CMDVCC, CLKDIV1 and CLKDIV2 signals to enable CLK.
handbook, full pagewidth
tact
OSC_INT/64 PRES, OFF
CMDVCC VCC I/O RSTIN STROBE RST
MGE738
high - Z
Fig.10 Activation sequence for synchronous application.
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
DEACTIVATION SEQUENCE When a session is completed, the microcontroller sets the CMDVCC line to HIGH state or MODE line to LOW state. The circuit then executes an automatic deactivation sequence by counting the sequencer down and ends in idle mode.
TDA8002
Figures 11 and 12 illustrate the deactivation sequence as described below: 1. RST goes LOW (t11 t10) 2. CLK is stopped (t12 = t11 + 12T) 3. I/O, AUX1, AUX2 are outputs into high-impedance state (t13 = t11 + T) 4. VCC falls to zero (t14 = t11 + 112T); a special circuitry ensures that I/O remains below VCC during falling slope of VCC 5. VUP falls (t15 = t11 + 5T).
handbook, full pagewidth
tde
OSC_INT/64 t10 t15 VUP t14 VCC t13 I/O t12 CLK RSTIN RST t11
MGE739
CMDVCC
high - Z
Fig.11 Deactivation sequence.
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
Fault detection The following fault conditions are monitored by the circuit: * Short-circuit or high current on VCC * Removing card during transaction * VDD dropping * Overheating.
TDA8002
When one or more of these faults are detected, the circuit pulls the interrupt line OFF to its active LOW state and a deactivation sequence is initiated. In case the card is present the interrupt line OFF is set to HIGH when the microcontroller has reset the CMDVCC line HIGH (after completion of the deactivation sequence). In case the card is not present OFF remains LOW.
handbook, full pagewidth
tde
OSC_INT/64 t10
OFF PRES
t14 VCC t13 I/O t12 CLK RST t11
MGE740
high - Z
Fig.12 Emergency deactivation sequence.
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); note 1. SYMBOL VDD Vi(CMOS) PARAMETER supply voltage voltage on CMOS pins XTAL1, XTAL2, ALARM, ALARM, MODE, RSTIN, CLKSEL, AUX2UC, AUX1UC, CLKDIV1, CLKDIV2, CLKOUT, STROBE, CMDVCC and OFF Vi(card) voltage on card contact pins I/O, AUX2, PRES, PRES, AUX1, CLK, RST and VCC Ves electrostatic handling on pins I/O, RST, VCC, CLK, AUX1, AUX2, PRES and PRES on all other pins Tstg Ptot storage temperature continuous total power dissipation TDA8002T TDA8002G Tamb Tj Note operating ambient temperature junction temperature Tamb = -25 to +85 C Tamb = -25 to +85 C - - -25 - 0.56 0.46 +85 150 -6 -2 -55 +6 +2 -0.3 +6.5 -0.3 +6.5 CONDITIONS MIN. -0.3
TDA8002
MAX. +6.5 V V
UNIT
V
kV kV C W W C C
+125
1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional operation of the device under this condition is not implied. HANDLING Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM 1500 , 100 pF) 3 positive pulses and 3 negative pulses on each pin referenced to ground. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) SOT136-1 SOT401-1 PARAMETER thermal resistance from junction to ambient in free air 70 91 K/W K/W VALUE UNIT
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Philips Semiconductors
Product specification
IC card interface
CHARACTERISTICS VDD = 5 V; Tamb = 25 C; fxtal = 10 MHz; unless otherwise specified. SYMBOL Supply VDD positive supply voltage option 5 V power supply (TDA8002xx/5) option 3.3 V or 5 V power supply (TDA8002xx/3) IDD(sl) IDD(idle) supply current supply current sleep mode; VDD = 5 V idle mode; VDD = 5 V; fCLK = 2.5 MHz; fCLKOUT = 10 MHz active mode VDD = 5 V; fCLK = 2.5 MHz; fCLKOUT = 10 MHz VDD = 3.3 V; fCLK = 2.5 MHz; fCLKOUT = 10 MHz Vth2 threshold voltage on VDD for voltage supervisor falling option 5 V power supply (TDA8002xx/5) 3.9 4.05 2.7 - - 4.5 3 - - 5 5 - - PARAMETER CONDITIONS MIN. TYP.
TDA8002
MAX.
UNIT
6.5 6.5 200 6
V V A mA
IDD(active)
supply current
9
mA
-
-
12
mA
4.2 2.8
V V
option 3.3 V or 5 V power 2.6 supply (TDA8002xx/3) rising option 5 V power supply (TDA8002xx/5) option 3.3 or 5 V power supply (TDA8002xx/3) Vhys2 CARD SUPPLY VCC(O)(idle) output voltage idle mode active mode ICC < 20 mA: DC load with 3 V < VDD < 3.3 V ICC < 65 mA: DC load with 3.3 V < VDD < 6.5 V ICC = 40 mA: AC load ICC(O) output current VCC(O) = from 0 to 5 V VCC short-circuited to ground SR slew rate rising or falling slope 4.75 4.75 4.6 - - 0.12 - hysteresis on Vth2 4 2.7 100
4.2 2.85 150 - - - - - - 0.17
4.4 2.99 200
V V mV
0.4 5.25 5.25 5.4 65 100 0.22
V V V V mA mA V/s
VCC(O)(active) output voltage
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
TDA8002
SYMBOL
PARAMETER
CONDITIONS - 2
MIN.
TYP. -
MAX.
UNIT
Crystal connections (XTAL1 and XTAL2) Cext fxtal Data lines GENERAL tedge delay between falling edge of I/O, AUX1, AUX2 and I/OUC, AUX1UC, AUX2UC delay between falling edge of I/OUC, AUX1UC, AUX2UC and I/O, AUX1, AUX2 tr, tf VOH(I/O) VOL(I/O) VIH(I/O) VIL(I/O) VI/O(idle) Rpu Iedge IIL(I/O) IIH(I/O) rise and fall times Ci = Co = 30 pF IOH = -20 A IOH = -100 A II/O = 1 mA DATA LINES I/O, AUX1 AND AUX2 HIGH-level output voltage on data lines LOW-level output voltage on data lines HIGH-level input voltage on data lines LOW-level input voltage on data lines voltage on data lines outside a session internal pull-up resistance between data lines and VCC current from data lines when active pull-up is active LOW-level input current on data lines HIGH-level input current on data lines VIL = 0.4 V VIH = VCC VCC - 0.5 - 3.5 - 1.8 0 - 8 - - - - - - - - 10 1 - - VCC + 0.1 V - 300 VCC 0.8 0.4 12 - -600 10 V mV V V V k mA A A - 200 - ns external capacitors resonance frequency note 1 note 2 15 - pF MHz 24
-
200
-
ns
-
-
0.5
s
DATA LINES I/OUC, AUX1UC AND AUX2UC VOH(I/OUC) VOL(I/OUC) VIH(I/OUC) VIL(I/OUC) ZI/OUC(idle) HIGH-level output voltage on data lines LOW-level output voltage on data lines HIGH-level input voltage on data lines LOW-level input voltage on data lines impedance on data lines outside a session IOH = -20 A II/OUC = 1 mA VDD - 1 - 0.7VDD 0 10 - - - - - VDD + 0.2 V 300 VDD 0.3VDD - mV V V M
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Philips Semiconductors
Product specification
IC card interface
TDA8002
SYMBOL
PARAMETER
CONDITIONS - - - - -
MIN. - - - - - - - - 16 - - -
TYP.
MAX.
UNIT A V A V A V ms
ALARM, ALARM and OFF when connected (open-drain outputs) IOH(ALARM) VOL(ALARM) IOH(OFF) VOL(OFF) IOL(ALARM) VOH(ALARM) tW HIGH-level output current on pin ALARM LOW-level output voltage on pin ALARM HIGH-level output current on pin OFF LOW-level output voltage on pin OFF LOW-level output current on pin ALARM HIGH-level output voltage on pin ALARM ALARM pulse width VOH(ALARM) = 5 V IOL(ALARM) = 2 mA VOH(OFF) = 5 V IOL(OFF) = 2 mA VOL(ALARM) = 0 V IOH(ALARM) = -2 mA 5 0.4 5 0.4 -5 - 20
VDD - 1 6
Clock output (CLKOUT; powered from VDD) fCLKOUT VOL VOH tr, tf frequency on CLKOUT low power LOW-level output voltage HIGH-level output voltage rise and fall times duty factor IOL = 1 mA IOH = -1 mA CL = 15 pF; notes 3 and 5 CL = 15 pF; notes 3 and 5 active mode sleep mode Card reset output (RST) VO(inact) td(RST) VOL VOH output voltage delay between RSTIN and RST LOW-level output voltage HIGH-level output voltage inactive modes RST enabled IOL = 200 A IOH = -200 A IOH = -50 A Card clock output (CLK) VO(inact) VOL VOH tr tf SR output voltage LOW-level output voltage HIGH-level output voltage rise time fall time duty factor slew rate (rise and fall) inactive modes IOL = 200 A IOH = -50 A CL = 30 pF; note 3 CL = 30 pF; note 3 CL = 30 pF; note 3 0 0 - - 45 0.2 - - - - - - 0.3 0.3 VCC 8 8 55 - V V V ns ns % V/ns 0 - 0 4.3 - - - - 0.3 100 0.3 VCC VCC V ns V V V 0 - 0 - 40 20 - 0.5 - 8 60 MHz kHz V V ns %
VDD - 0.5 -
Internal oscillator fint frequency of internal oscillator 2.2 - 2.7 32 3.2 - MHz kHz
VCC - 0.5 -
VCC - 0.5 -
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Philips Semiconductors
Product specification
IC card interface
TDA8002
SYMBOL
PARAMETER
CONDITIONS
MIN. - - - - - - - - -
TYP.
MAX.
UNIT
Strobe input (STROBE) fSTROBE VIL VIH VIL VIH VIL VIH IIL(PRES) IIH(PRES) Protections Tsd ICC(sd) Timing tact tde t3 t5 Notes 1. It may be necessary to put capacitors from XTAL1 and XTAL2 to ground depending on the choice of crystal or resonator. 2. When the oscillator is stopped in mode 1, XTAL1 is set to HIGH. t1 3. The transition time and duty cycle definitions are shown in Fig.13; = -------------t1 + t2 4. PRES and CMDVCC are active LOW; RSTIN and PRES are active HIGH. 5. CLKOUT transition time and duty cycle do not need to be tested. activation sequence duration deactivation sequence duration start of the window for sending CLK to the card end of the window for sending CLK to the card see Fig.9; guaranteed by design see Fig.11; guaranteed by design see Figs 8 and 9 see Fig.8 - 50 - 150 180 70 - - 220 90 130 - s s s s shut-down local temperature shut-down current at VCC - - 135 - - 90 C mA frequency on STROBE LOW-level input voltage HIGH-level input voltage 0 0 0.7VDD 0 1.8 0 0.7VDD VOL = 0 V - - 20 0.3VDD VDD 0.8 VDD 0.3VDD VDD -10 10 MHz V V
Logic inputs (CLKSEL, CLKDIV1, CLKDIV2, MODE, CMDVCC and RSTIN); note 4 LOW-level input voltage HIGH-level input voltage LOW-level input voltage HIGH-level input voltage LOW-level input current on pin PRES HIGH-level input current on pin PRES V V V V A A
Logic inputs (PRES, PRES); note 4
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Philips Semiconductors
Product specification
IC card interface
TDA8002
handbook, full pagewidth
tr 90%
tf 90% VOH 1/2 VCC 10% t1 10% t2 VOL
MGE741
Fig.13 Definition of transition times.
1997 Nov 04
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Philips Semiconductors
Product specification
IC card interface
APPLICATION INFORMATION
TDA8002
handbook, full pagewidth
33 pF f = 14.75 MHz
33 pF
+5 V VCC P0-0 P0-1 P0-2 P0-3 P0-4 P0-5 P0-6 P0-7 EA 80C51 ALE PSEN P2-7 P2-6 P2-5 P2-4 P2-3 P2-2 P2-1 P2-0
P1-0 P1-1 P1-2 MODE OFF RSTIN CARD READ LM01 C5I C6I C7I C8I C1I C2I C3I C4I CMDVCC VCC RST CLK AUX1 PRES AUX2 I/O K1 K2 VUP S1 VDDA 28 27 26 25 24 23 22 21 20 19 18 17 16 15 TDA8002A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 XTAL1 XTAL2 I/OUC AUX1UC AUX2UC ALARM CLKSEL CLKDIV1 CLKDIV2 STROBE CLKOUT DGND1 AGND S2 100 nF 100 nF 100 nF 100 nF 10 F P1-3 P1-4 P1-5 P1-6 P1-7 RST P3-0 P3-1 P3-2 P3-3 P3-4 P3-5 P3-6 P3-7 XTAL2 XTAL1 VSS
MGE742
Fig.14 Application diagram (for more details, consult "Application Note AN96096").
1997 Nov 04
20
Philips Semiconductors
Product specification
IC card interface
PACKAGE OUTLINES SO28: plastic small outline package; 28 leads; body width 7.5 mm
TDA8002
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1997 Nov 04
21
Philips Semiconductors
Product specification
IC card interface
TDA8002
LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
SOT401-1
c y X
24 25
17 16 ZE
A
e E HE wM bp 32 1 8 9 L detail X Lp A A2 A1 pin 1 index (A 3)
e bp D HD
ZD wM B
vM A
vM B
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT401-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 1.60 A1 0.15 0.05 A2 1.5 1.3 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 5.1 4.9 E (1) 5.1 4.9 e 0.5 HD 7.15 6.85 HE 7.15 6.85 L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 0o
o
ISSUE DATE 95-12-19 97-08-04
1997 Nov 04
22
Philips Semiconductors
Product specification
IC card interface
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all LQFP and SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 50 and 300 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. Wave soldering LQFP Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. CAUTION Wave soldering is NOT applicable for all LQFP packages with a pitch (e) equal or less than 0.5 mm.
TDA8002
If wave soldering cannot be avoided, for LQFP packages with a pitch (e) larger than 0.5 mm, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. SO Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. METHOD (LQFP AND SO) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Nov 04
23
Philips Semiconductors
Product specification
IC card interface
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8002
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Nov 04
24
Philips Semiconductors
Product specification
IC card interface
NOTES
TDA8002
1997 Nov 04
25
Philips Semiconductors
Product specification
IC card interface
NOTES
TDA8002
1997 Nov 04
26
Philips Semiconductors
Product specification
IC card interface
NOTES
TDA8002
1997 Nov 04
27
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/03/pp28
Date of release: 1997 Nov 04
Document order number:
9397 750 02454

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